Scholars

Ephraim Suhir

Prof.

Portland State University, USA
Life Fellow of IEEE, ASME, SPIE, IMAPS; Fellow of APS, IoP; Associate Fellow of AIAA

Editor-in-Chief of ASME Journal of Electronic Packaging\; Springer's book series on physics, mechanics and reliability of materials in micro- and opto-electronics; Silicon Valley Engineering Council Journal

Patrick Siarry

Prof.

University of Paris-Est Créteil, France
Top 2% Scientists Worldwide

Editor-in-Chief of "Engineering Applications of Artificial Intelligence"

Raul Duarte Salgueiral Gomes Campilho

Prof.

Instituto Superior de Engenharia do Porto, Portugal
Top 2% Scientists Worldwide

Reviewer of Journal of Adhesion Science and Technology, International Journal of Adhesion & Adhesives, Composite Structures, Engineering Fracture Mechanics, International Journal of Fracture, Computational Materials Science

El-Sayed Salama

Prof.

Lanzhou University, China
Top 2% Scientists Worldwide by Stanford University

Editorial Board Member of "Biomass Conversion and Biorefinery", "World Journal of Microbiology and Biotechnology"

Xinggang Yan

Assoc. Prof.

University of Kent, UK
Chief-Editor of the Journal of Electronics & Information Systems

Editorial Board Member of IET Control Theory & Applications, Journal of the Franklin Institute, Complexity, Energies and Mathematics Problems in Engineering

Vijayakumar Varadarajan

Prof.

University of New South Wales, Australia

Lead Guest Editor for few journals in Inderscience, Springer, Elsevier, IOS, UM and IGI Global

Noor Zaman Jhanjhi

Prof.

Taylor's University, Malaysia
Top 2% Scientist; IEEE Member, ACMMember, ISOC Member, PEC Member

Editorial Board Member, Guest Editor, and Reviewer for International Journals

George K. Adam

Prof.

University of Thessaly, Greece
Senior Member of IEEE and ACM

Reviewer and Guest Editor for International Journals

ScholarHUB